Abstract:
Today's high-density packaging technologies make early attention to most factors essential in the design of successful products. A process-oriented, scalable cost-modelin...Show MoreMetadata
Abstract:
Today's high-density packaging technologies make early attention to most factors essential in the design of successful products. A process-oriented, scalable cost-modeling tool, the Modular Optimization Environment (MOE), enables a continuous cost-quality-performance trade-off analysis throughout the design and manufacturing process.
Published in: IEEE Design & Test of Computers ( Volume: 15, Issue: 3, July-Sept. 1998)
DOI: 10.1109/54.706029