Abstract:
The importance of inductance and inductive coupling for accurate delay and crosstalk prediction in on-chip interconnections is investigated experimentally for the top thr...Show MoreMetadata
Abstract:
The importance of inductance and inductive coupling for accurate delay and crosstalk prediction in on-chip interconnections is investigated experimentally for the top three layers in a five-layer wiring structure and guidelines are formulated. In-plane and between-plane crosstalk and delay dependence on driver and receiver circuit device sizes and line lengths and width are analyzed with representative CMOS circuits. Simplified constant-parameter, distributed coupled-line RLC-circuit representation that approximates the waveforms predicted with frequency-dependent line parameters is shown to be feasible.
Published in: Electrical Performance of Electronic Packaging
Date of Conference: 27-29 October 1997
Date Added to IEEE Xplore: 06 August 2002
ISBN Information: