Application of laser engraving for the fabrication of fine resolution printed wiring laminates for MCM-Ls

Recognising the immediate need for improvement of the technological capabilities of low cost, high performance electronic circuit modules in countries of Central Europe, the leading research institutions and small/medium-size enterprises of Hungary, Romania and Slovenia with the support of relevant institutions of the United Kingdom and Belgium have applied for the assistance of the European Union to establish fast prototyping low cost multichip module (MCM) technology facilities. The manufacturing system will integrate new processing technologies with well-established ones in all development phases, including design, manufacturing, assembling and test; its application will result in a faster prototyping and shorter production period.