High performance 600 V smart power technology based on thin layer silicon-on-insulator

A high-performance 600 V smart power technology has been developed in which novel lateral double-diffused MOS transistors (LDMOS) are merged with a BiCMOS process flow for the construction of power integrated circuits on bonded silicon-on-insulator (BSOI) substrates. All active and passive device structures have been optimized for fabrication on BSOI layers which are less than 1.5 /spl mu/m-thick, with buried oxide layers in the range of 2.0 to 3.0 /spl mu/m-thick. Complete dielectric isolation processing is straightforward due to the use of a thin SOI active device layer. A dual field plate design of the high-voltage devices results in at least a factor-of-two reduction in specific on-resistance over conventional LDMOS structures for a given breakdown voltage.