Low-loss, self-aligned flip-chip technique for interchip and fiber array to waveguide OEIC packaging

A flip-chip packaging technique with submicron alignment precision, using V-grooved Si motherboards, allows the realization of OEIC modules with self-aligned coupling of single mode fiber arrays to waveguide arrays together with direct optical connection of different, separately optimized waveguide devices. The passive optical self-alignment of array interconnections combined with the relatively large mounting and etching tolerances of the Si motherboard is promising as a generally useful, high precision, low cost packaging technique for OEICs.