The use of side wall images to compute package effects in MoM analysis of MMIC circuits

A formulation of the method of moments solution of shielded, enclosed microstrip MMIC circuits is presented. The technique involves first computing a circuit's mutual impedance characteristics with no lateral enclosure and then adding a correcting term resulting from the images introduced by lateral side walls. The method is especially useful for determining the impact of low-Q package resonances in very large packages. Large lateral enclosure size does not degrade the efficiency of this technique. The importance of the TM/sub 0/ parallel-plate mode in MMIC circuit coupling is emphasized.<
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